CuNex, a member of the SCHLENK Group, specializes in advanced copper sinter pastes and preforms for die-attach, topside-attach and substrate-attach applications. Designed and manufactured in Germany, its copper-based interconnect materials combine low cost, low pressure processing, and rapid sintering to deliver outstanding reliability and performance. The Cuprum paste and CuForm preform product families support a wide range of applications, including Si, SiC and GaN semiconductors, PCBs and battery technologies. Built on more than five years of dedicated research in copper interconnect solutions, CuNex benefits from SCHLENK’s 150 years of expertise in copper and copper alloy processing. Backed by volume manufacturing capabilities and a secure global supply chain, CuNex provides innovative and reliable bonding solutions for next-generation power electronics that unlock cost savings > 70% vs. silver sintering.
ECPE European Center for Power Electronics e.V
ECPE European Center for Power Electronics e.V., founded in 2003 is the leading industry-driven Research Network in the field of Power Electronics in Europe with more than 240 member organizations, comprising Member companies and Competence Centres. As a European technology and innovation platform, ECPE is driving precompetitive joint research and set up research & technology roadmaps for a strategic research agenda with future research directions according to the demands of European power electronics industry. The ECPE expert workshops and advanced training programme cover a wide range of current topics addressed especially to engineers from industry
The Power Electronics Cluster is supported by the Bavarian State Government as part of the Bavarian Cluster Initiative. It brings together companies and research institutions from the field of power electronics to promote innovation, knowledge exchange and cooperation at regional and national level. Today, it comprises 123 companies and 35 research institutions from Bavaria. The Cluster’s activities focus on education and training, research and innovation, networking, and public relations.
Founded in 1985 and headquartered in Erlangen, Germany, the Fraunhofer Institute for Integrated Systems and Device Technology IISB employs around 500 people. Building on decades of expertise in power electronics, the institute covers the entire value chain—from semiconductor materials and chip fabrication to packaging, power modules and complete systems. Its technological strengths include silicon carbide (SiC) and gallium nitride (GaN) devices, advanced thermal management, electromagnetic compatibility and system integration.
For aviation and space applications, IISB develops efficient, compact and reliable power conversion and distribution technologies. Its aviation portfolio spans 60 V to 3 kV and 1 kW to several megawatts, including DC/DC converters, motor drives, battery systems and DC grid control, complemented by cryogenic power electronics for future aircraft propulsion.
Description follows soon.
For more than 25 years, OPAL-RT TECHNOLOGIES has been a global leader in real-time simulation and Hardware-in-the-Loop (HIL) testing. Since 1997, OPAL-RT has provided engineers and researchers with accessible, innovative, and customized simulation technologies, bridging the gap between modeling and real-world applications. By harnessing the power of high-performance computing, OPAL-RT accelerates the development of cutting-edge solutions in energy, automotive, aerospace, and other industries. Today, the company operates in more than 40 countries.
Follow OPAL-RT TECHNOLOGIES at opal-rt.com as well as on LinkedIn, Facebook, X, Instagram, and YouTube.
Description follows soon.
Description follows soon.
Price: 1,800€ and includes:
Table with chairs
Including lunch & coffee break
1 poster wall
Your Logo on the PEASA Homepage
incl. 1 Exhibitor pass (ONLY access to the exhibition, catering on both days,
and dinner on the 1st day)
Price: 5,000€ and includes:
Tables with chairs
Your Logo on the PEASA Homepage and Workshop book
Logo and advertising document on the online proceedings
incl. 2 Workshop Tickets (FULL access to workshop, exhibition, catering on both days,
dinner on the 1st day, and technical visit at Fraunhofer IISB)
incl. 2 Exhibitor passes (ONLY access to the exhibition, catering on both days,
and dinner on the 1st day)
Click here to be a Sponsor or Exhibitor at PEASA Europe 2026
For any problems with registration, please contact our ECPE contact: marietta.didio@ecpe.org